Research Foundation - 华东理工大学智能传感与仪器研究院1

Research

Device Name	Model	Main Purpose
Compact Desktop Maskless Laser Direct Writing Lithography System	MicroWriterML3	Pattern Transfer from Mask to Substrate
Spin Coater, Hot Plate, and Developer System	SPS POLOS	Photolithography Ancillary Equipment
Wet Etching and Cleaning Platform	SN-KS200	Chemical Etching and Surface Material Removal Using Specialized Reagents
Reactive Ion Etching System	SAMCO RIE-200NL	The process utilizes gaseous chemical etchants to undergo physical reactions, chemical reactions, or a combination of both physical and chemical reactions with the materials on the silicon wafer that are not covered by photoresist, thereby achieving the removal of exposed surface materials.
Plasma Cleaning System	Nano Low-pressure	Surface Plasma Cleaning and Modification Treatment
ASP Series Magnetron Sputtering Coating System	ANSEI TECH	High-Quality Thin Film Deposition
Multi-Target Magnetron Sputtering System	HHV-TF600	High-Quality Thin Film Deposition
Plasma-Enhanced Atomic Layer Deposition System	SC6-PEV	High-Quality Thin Film Deposition
Precision Dicing Saw		The process involves the precise segmentation of the entire wafer with completed circuit fabrication into independent chip units along pre-defined dicing streets.
Multi-functional Ball and Wedge Wire Bonder	MPP	Achieving a tight connection between the bonding wire and the substrate pads.
3D Optical Profiler	BRUKER ContourX-100	Analysis of thin film and device surface morphology
DLP 3D Printer	B9 Core 550 波长: 405 nm	Rapid prototyping and printing of flexible sensors
Femtosecond Laser Micro-Nano Processing System	600 1032nm 180fs 800 KHz	Laser micro-nano processing and metal surface treatment
Green Continuous Wave Laser Processing System	Verdi G1 532 nm 10 W	Laser Direct Writing of Flexible Sensors Laser-Induced Chemical Reactions
Blue Pulsed Laser	波长：400~450nm 功率：7W
High-precision inkjet printing and hybrid manufacturing platform for flexible circuits and antennas	Self-built system	Multimodal Intelligent Sensor Manufacturing
Field Emission Analytical Transmission Electron Microscope	FEI Talos F200X	Microscopic morphology, crystal structure, and crystal defect analysis of materials
Scanning Electron Microscope-Focused Ion Beam Dual-Beam System	FEI Helios G4 UC	Three-dimensional material reconstruction, STEM analysis, energy dispersive spectroscopy analysis, and EBSD analysis
Objective-Corrected Environmental Transmission Electron Microscope	FEI Themis ETEM	Research on the atomic structure of materials
Double Aberration-Corrected Transmission Electron Microscope	FEI Themis Z	Research on the atomic structure of materials
Multi-angle Scattering Instrument	Wyatt Dynapro NanoStar	Measurement and analysis of molecular weight distribution, root-mean-square radius (radius of gyration), second virial coefficient, and hydrodynamic radius
Data Acquisition System	Agilent 34972A	Data recording and acquisition for sensors and integrated circuits
Electrochemical Workstation	CHI660E	Cyclic voltammetry, electrochemical impedance spectroscopy, and alternating current voltammetry measurements for devices
Impedance Analyzer	IM3536	Device impedance analysis
NI Data Acquisition (DAQ) System	cDAQ-9174	Measurement of sensors, load cells, and bridges
Semiconductor Analyzer	Keithley 4200A-SCS	Semiconductor characteristic measurement of devices
Vector Network Analyzer	安立MS46322B	Testing of passive devices
Nonlinear High-Energy Ultrasonic Testing System	RAM-5000 SNAP	Capable of detecting harmonic frequencies and testing the nonlinear characteristics of materials Equipped with dual gated amplifiers, suitable for nonlinear beam mixing tests involving sum and difference frequency generation
Ultrasonic Testing Platform	Vantage 256	Up to 256 independent channels for controlling transmission or reception parameters, supporting arbitrary waveform transmission Real-time parameter adjustment to obtain ideal data in a single acquisition
Two-dimensional component two-wave mixing interferometer	Tempo	Simultaneous detection of out-of-plane and in-plane displacement Ultra-high detection sensitivity Auto-focus functionality